Technavio: Global Flexible Substrates Market 2018-2022
15% CAGR Projection Over the Next Four Years
London, England - The global flexible substrates market is expected to post a CAGR of nearly 15% during the period 2018-2022, according to the latest market research report by Technavio.
A key factor driving the growth of the market is the increasing digitization and penetration of consumer electronic products. Technological advances such as the Internet of Things and cloud-based storage have significantly increased the use of flexible substrates for manufacturing electronic products. As a result, the adoption of multimedia devices, smart devices, and electronic gadgets has increased. Most of the critical messages and documents are stored and exchanged through computers, cellular phones, and other electronic devices.
This market research report on the global flexible substrates market 2018-2022 also provides an analysis of the most important trends expected to impact the market outlook during the forecast period. Technavio classifies an emerging trend as a major factor that has the potential to significantly impact the market and contribute to its growth or decline.
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In this report, Technavio highlights the increasing need for miniaturization and microelectronics as one of the key emerging trends in the global flexible substrates market:
Global flexible substrates market: Increasing need for miniaturization and microelectronics
In recent years, miniaturized electronic devices have reduced power consumption and increased functionalities. The size of the embedded components has reduced, which has led to the placement of more components. The size of cellular phone PCBs, for example, reduced by nearly 70%-80% between 2004 and 2017 along with the inclusion of numerous sensors and processors. Miniaturized components must be compactly arranged, which is not feasible on conventionally rigid PCBs. Flexible substrate printing technology overcomes this challenge.
“Flexible substrate-based miniature electronics require small PCBs and efficient interconnections to reduce overall power consumption. Large PCBs and thick interconnects can lead to signal propagation issues and power loss, thereby reducing uptime of battery-powered devices. Flexible substrates overcome these problems by using extremely thin conductors/interconnects, which efficiently transfer signals and power to all the connected components,” says a senior analyst at Technavio for research on specialty chemicals.
Global flexible substrates market: Segmentation analysis
This market research report segments the global flexible substrates market by application (CE, SE, MH, and AD) and geographical regions (APAC, EMEA, and the Americas).
The CE segment held the largest market share in 2017, accounting for nearly 65% of the market. This application segment is expected to dominate the global market throughout the forecast period.
APAC led the market in 2017 with a market share of nearly 69%. This region is expected to dominate the market through 2022, with an increase in its market share.
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Some of the key topics covered in the report include:
- Market ecosystem
- Market characteristics
- Market segmentation analysis
- Market definition
- Market size and forecast
Five Forces Analysis
- Regional comparison
- Key leading countries
- Vendors covered
- Vendor classification
- Market positioning of vendors
- Competitive scenario
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