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iC-Haus GmbH Company Information

 

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Member Since Jan 2015 / Last Product Mar 2014
Intergrated Circuit

iC-Haus develops and manufactures application-specific standard products (ASSPs), application-specific integrated circuits (ASiCs) and is a leading specialist for monolithic mixed-signal circuits and microsystems. Our wafer backend, chip-assembly- and test-facilities are located in Bodenheim near Frankfurt in the center of Europe. Our subcontracted wafer foundries and assemblers are situated all over the world and assure reliable, secondsourced products and deliveries. Quality engineering has been established in international standards, such as ISO9001. iC-Haus products are authorized for automotive, military and industrial use and follow FMEA methods and safety requirements.

Our range of technologies covers high voltage, linear bipolar, high density and analog CMOS and power BCD processes. With optional optolayers we have created OPTO-ASiCs, monolithic microsystems which have integrated sensors. Assembly is performed in standard plastic packages and for the OPTO and power ICs in the Chip-On-Board/Flex and Flip-Chip technique. Packaging can be customized, e.g. with multi-chip-modules; furthermore, the chip layout and circuit topology is tailored to customer's individual requirements, resulting in exclusive ASiCs from iC-Haus.
 
 
 
Am Kuemmerling 18
Bodenheim 55294
Germany

Map for iC-Haus GmbH in Bodenheim Germany


http://www.ichaus.de
+49 61 35 / 92 92-0